Distributed, Ambient and Pervasive Interactions Best Paper Award

11th International Conference on Distributed, Ambient and Pervasive Interactions Best Paper Award. Details in text following the image.

Best Paper Award for the 11th International Conference on Distributed, Ambient and Pervasive Interactions, in the context of HCI International 2023, Copenhagen, Denmark, 23-28 July 2023

Certificate for best paper award of the 11th International Conference on Distributed, Ambient and Pervasive Interactions. Details in text following the image

Certificate for Best Paper Award of the 11th International Conference on Distributed, Ambient and Pervasive Interactions

The award has been conferred to
Takuma Anakubo and Kaori Fujinami
(Tokyo University of Agriculture and Technology, Japan)


Kaori Fujinami
(presenter)


for the paper entitled

"DeforVerFace: Modular Linear-Deformable Vertical Surface"

Presented in the context of
HCI International 2023
Copenhagen, Denmark
23 - 28 July 2023

Paper Abstract
"In recent years, shape change interfaces have been the focus of attention, where novel interaction techniques and application possibilities have been explored through the incorporation of shape change into static objects. In this paper, we focus on the interaction with shape-changing vertical surfaces. Existing work on vertical plane interaction is mainly concerned with visual representation using projection mapping or shape change to present interaction results. We believe that the reason for the limitation of the interaction method is that the vertical surface, such as the wall and the door, is inherently fixed. In this paper, we propose a shape-changing vertical surface that goes beyond mere 2D interaction space, which we call DeforVerFace. DeforVerFace consists of a set of linear deformable elements and modules for sensing the nearby environment. In this paper, we design and implement DeforVerFace and present a user study aimed at understanding the possibilities of a shape-changing vertical surface in our everyday building environment."

The full paper is available through SpringerLink, provided that you have proper access rights.